You will be part of our Field Applications team and serve as a technical lead supporting our customers in advanced electron beam lithography (EBL) and scanning electron microscopy (SEM) applications. You will actively enable the integration of Raith products into the process sequences & workflows at customer sites to accelerate ROI. You will work with customer engineers to develop customized Raith solutions together with our global Applications development team to advance key customer needs such as qualification of new tools, process ramp-up, and yield, and implement them onsite. The position will be based in Vancouver, WA. 
Salary range: $120,000 - $170,000 (depending on location end experience level)

• Lead and support customer-facing applications projects for EBL and SEM inspection systems and implement newly developed solutions on-site.
• Actively develop new applications and solutions together with our Applications development team to advance industrial implementation of nanoscale technologies using Raith systems.
• Serve as a trusted technical advisor to customers, with deep expertise in EBPG systems and their optimization for maximum performance.
• Feed back customer needs and performance requirements from the field to Raith stakeholders.

• PhD or Masters degree in physics, materials science, electrical engineering, or a related field, with preferably 3 years relevant work experience.
• Strong background in nanofabrication, metrology, and data-driven analysis.
• Exceptional problem-solving ability with a results-driven mindset.
• Understanding of semiconductor processing, failure analysis techniques, statistical process control & process optimization.
• Excellent, clear communication skills and collaborative attitude as well as proven track record of meeting customer needs and nurturing a positive relationship.
• Proficiency with statistical analysis software (JMP, Minitab).
• Ability to travel domestically and internationally